Our product range includes a wide range of vigon reflow oven cleaner, rework flux cleaner and stencil cleaning vigon sc 200.
Vigon Reflow Oven Cleaner
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Product Details:
Packaging Size
500 ml
Brand
Vigon
Grade Standard
Reagent Grade
Packaging Type
Bottle
Usage/Application
Cleaning
Physical State
Liquid
Density
101 (g/cm3)
Cleaner Type
Manual
Cleaning temperature
20 to 50 degree Celsius
Surface tension
318 (N/m)
Solubility in water
Soluble
Model Number
RC 303
VIGON® RC 303 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes recondensed fluxes and emissions from assemblies. As the successor to VIGON® RC 101, VIGON® RC 303 delivers an improved cleaning performance with the same high level of operator safety.
Advantages
Improved cleaning performance
Mild formulation, high operator safety
No flash point
Environmentally friendly
No special labeling is required
Little odor
Excellent material compatibility with aluminum and epoxy surfaces
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Rework Flux Cleaner
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Product Details:
Packaging Size
300 ml
Brand
VIGON
Usage/Application
For Industrial Use, Laboratory
Grade Standard
Technical Grade
Model Name/Number
EFM
Packaging Type
Bottle
Solubility in water
Not Soluble
Surface tension
18.6 (N/m)
Density
0.72 (g/cm3)
Application concentration
Ready-to-use
Cleaning temperature
Ambient Temperature
VIGON EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. This product can also be used in explosion-proof spray-in-air equipment. VIGON® EFM is a mixture of halogen-free organic solvents. It dries fast and residue-free. VIGON® EFM is non-corrosive and compatible with most polymers.
Advantages
Especially suitable for the removal of resin-based flux residues
This product dries very fast and residue-free
Easy-to-use, for both manual and automatic cleaning in explosion-proof equipment
Very suitable as a cleaning and rinsing agent
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STENCIL CLEANING VIGON SC 200
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Product Details:
Brand
Zestron
Physical State
Liquid
Usage/Applications
For Industrial Use
Packaging Type
Can
Model Name/Number
Vigion SC 200
Boiling range
95-212 Deg. C
pH value(10g/|H20)
Neutral
Cleaning Temperature
20-50 Deg.C
Vapor Pressure
18.1 mbar
Packaging Size
1L,5L,25L
VIGON SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. Based on the MPC Technology, the cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers. It is designed for the use in spray-in-air and ultrasonic cleaning systems and is also recommended for cleaning misprinted solder paste. Depending on the type of fluxes, VIGON SC 200 can also be suggested for both double-sided and single-sided soldered circuit boards applications.
