Cleaning Chemicals

Product Details:

VIGON SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. Based on the MPC Technology, the cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers. It is designed for the use in spray-in-air and ultrasonic cleaning systems and is also recommended for cleaning misprinted solder paste. Depending on the type of fluxes, VIGON SC 200 can also be suggested for both double-sided and single-sided soldered circuit boards applications.

Product Details:

VIGON® RC 303 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes recondensed fluxes and emissions from assemblies. As the successor to VIGON® RC 101, VIGON® RC 303 delivers an improved cleaning performance with the same high level of operator safety.

Advantages

• Improved cleaning performance
• Mild formulation, high operator safety
• No flash point
• Environmentally friendly
• No special labeling is required
• Little odor
• Excellent material compatibility with aluminum and epoxy surfaces

Product Details:

VIGON EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. This product can also be used in explosion-proof spray-in-air equipment. VIGON® EFM is a mixture of halogen-free organic solvents. It dries fast and residue-free. VIGON® EFM is non-corrosive and compatible with most polymers.

Advantages

• Especially suitable for the removal of resin-based flux residues
• This product dries very fast and residue-free
• Easy-to-use, for both manual and automatic cleaning in explosion-proof equipment
• Very suitable as a cleaning and rinsing agent