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Product Details:
| Minimum Order Quantity | 1 Jar |
| Packaging Size | 500 gm |
| Material Type | Paste |
| Brand | Choksi Heraeus |
| Material Melting Temperature | 179-183 degree C |
| Model Name/Number | F381AT |
| Shelf Life | 6 Months |
| Usage/Application | Industrial |
| Code | F381-AT, F352 |
| Net wt. | 500g |
| Particle size | 25-45 micron |
Heraeus offers a full line of no clean, solvent clean and water soluble pastes. These lead & lead free pastes provide industry leading wetting and outstanding void performance on a variety of component termination and surfaces. The products feature wide process windows which reduces processing cost significantly, makes set up easy and saves time.
Product Details:
| Minimum Order Quantity | 1 Unit |
| Packaging Size | 500 gm |
| Usage/Application | Industrial |
| Brand | Choksi Heraeus |
| Physical State | Solid |
| Material Type | Paste |
| Material Melting Temperature | 217-229 Degree C |
| Shelf Life | 6 Months |
| Model Number | F-640 |
| Particle Size | 25-45 micron |
F 640 Solder Paste series is state of the art leads free no clean solder paste that promotes wetting and minimizes soldering defects. The F 640 flux system is specifically optimized for Sn/Ag/Cu alloy soldering. Extensive testing at customer locations has proven this paste to be capable of defect-free performance in the production environment.
The F 640 Series exhibits minimal slump and has excellent print-after-wait performance. This formula provides superior performance on a variety of surfaces finishes and leaves behind a clear residue.