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Solder Paste

Solder paste is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. Heraeus solder pastes guarantee the perfect match to various applications with the InnoRel series in combination with the Innolot® alloy. We offer proven high reliability solder pastes for the automotive electronics industry.


Solder Paste

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Solder Paste
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Product Details:
Minimum Order Quantity1 Jar
Material TypePaste
BrandChoksi Heraeus
Material Melting Temperature179-183 degree C
Shelf Life6 Months
Usage/ApplicationIndustrial
CodeF381-AT, F352
Net wt.500g
Particle size25-45 micron

Heraeus offers a full line of no clean, solvent clean and water soluble pastes. These lead & lead free pastes provide industry leading wetting and outstanding void performance on a variety of component termination and surfaces. The products feature wide process windows which reduces processing cost significantly, makes set up easy and saves time.

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    Lead Free Solder Paste

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    Lead Free Solder Paste
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    Product Details:
    Minimum Order Quantity1 Jar
    Material Typepaste
    BrandChoksi Heraeus
    Material Melting Temperature217-229 Degree C
    Shelf Life6 Months
    Model NumberF-640
    Usage/ApplicationIndustrial
    Particle Size25-45 micron

    F 640 Solder Paste series is state of the art leads free no clean solder paste that promotes wetting and minimizes soldering defects. The F 640 flux system is specifically optimized for Sn/Ag/Cu alloy soldering. Extensive testing at customer locations has proven this paste to be capable of defect-free performance in the production environment.
    The F 640 Series exhibits minimal slump and has excellent print-after-wait performance. This formula provides superior performance on a variety of surfaces finishes and leaves behind a clear residue.

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